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New laser cleaning system

17 November 2014

The Laser Cleaning Unit offers a completely new, gentle and precise cleaning module for contaminated baking plates. 

It can be used on all ovens of the series SWAKN and SWAKT and is suitable for all baking plates and plate dimensions, all flat, and almost all hollow wafer engravings. The cleaning unit is highly flexible and applicable to all new machines using a standardized interface. Furthermore, it can be retrofit to previous models. The cleaning device is easy to operate using a plug-and-play concept. It comes with fast set-up, is fully automated and is connected to the oven PLC.
 
If you are producing wafers, you know the trouble: Sticky residue needs to be scraped from the baking plates in order for the plates and the wafers to separate cleanly. Previously you have cleaned your baking plates with dry ice, brushes or chemicals – three methods whose advantages are all marred by at least one disadvantage. “Time for a new idea,” we thought at Franz Haas Wafer and came up with the laser. It removes fat, sugar and batter residues from the baking plates without direct contact – even gentler than dry ice, more reliably than a brush and environmentally friendlier than chemicals.
 
One cleaning shift takes 8 hours for an 88 baking plate oven with a plate format of 350 x 500 mm. This makes the cleaning device your flexible assistant in your production. It is coupled to one oven and after finishing a cleaning shift, it can be transferred to the next oven thus saving time and money. The cleaning process does not need any assistance or any additional cleansing material and does not affect the warranty of the baking plates.
 
Your advantages at a glance:
 
  • no mechanical stress
  • gentle and precise cleaning
  • no damage to chromium plating
  • no residues due to suction system
  • environmentally friendly
  • no cleaners, no chemicals, no solvents


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