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STEMMER IMAGING to demonstrate vision for Industry 4.0 and machine learning capabilities at PPMA

20 August 2018

STEMMER IMAGING will be replicating a pick and place application by integrating industrial imaging capabilities into an Industry 4.0 environment using the new OPC UA communication standard. Also on show will be a 3D system using a machine learning method to read braille characters on boxes. In addition, 2D smart cameras and 2D vision sensors will be set up various configurations for OCR and code reading.

STEMMER IMAGING will be showing an OPC UA tool on an embedded vision system. This features an ARM-based NVidia Jetson TK1 board running STEMMER IMAGING’s Common Vision Blox (CVB) machine vision software, connected to a JAI GO camera. Building upon the VDMA’s OPC UA specification for vision systems, this new tool will allow vision systems to adopt a common architecture within an OPC UA open standard network, while being open enough to let individual features be applied. The demonstration interlinks a PLC, the vision system and a turntable, to allow the selection and movement of a particular component.

The 3D braille reading system uses STEMMER IMAGING’s machine learning-based pattern matching tool, CVB Polimago, to translate a height map of braille bumps into readable characters. A 3D camera from Automation Technology generates the height map from the braille bumps on the boxes as they pass through the system.  CVB 3D Tools are used to create and display a 3D model from the height map image. At the same time, Gocator 2340C intelligent line profilers from LMI measure the total volume of the bumps on each box.  

A conveyor-belt demonstration featuring a Boa 2 smart camera and Boa Spot IDE vision sensor from Teledyne DALSA will show barcode, 2D Datamatrix code and OCR capabilities on a variety of boxes. This highlights DALSA’s brand new high speed, high performance code reading algorithm and the cameras will also be individually filtered to read only from boxes of a specific colour. 

Stand A44, PPMA Show 2018, NEC, Birmingham UK, 25 - 27 September 2018

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